Key Specifications/Special Features:

• Brands: Atmel, Cypress, MXIC, Maxim, NSC, ST, TI, Winbond
• Package: C-DIP, P-DIP (one time), SOP, PLCC
• 27C256 (32K*8), 27C512 (64K*8), 27C010 (128K*8), 27C1024 (64K*16), 27C020 (256K*8), 27C2048 (128K*16), 27C040 (512K*8), 27C4096 (256K*16), 27C080 (1M*8), 27C800 (*16 or *8), 27C160 (2M*8), 27C322 (32M) 2M*16
• EEPROM
• (2-Wire)
• Brands: Atmel, Catalyst/ON, Samsung, Microchip, ST
• Package: DIP, SOP
• 24C01 (1K:128*8), 24C02 (2K:256*8), 24C04 (4K:512*8), 24C08 (8K:1024*8), 24C16(16K:2048*8), 24C32 (32K:4096*8), 24C64 (64K:8192*8), 24C256 (256K:16384*8)
• (3-Wire)
• Brand: Atmel, Catalyst, Samsung, Microchip, ST
• Package: DIP, SOP
• 93C46 (1K:*8or*16), 93C56 (2K:*8or*16), 93C66 (4K:*8or*16)
• Parallel EEPROMs
• Brand: Atmel, Catalyst/ON, NSC
• Package: DIP, PLCC, SOP
• 28C16 (16K:2K*8), 28C256 (256K:32K*8), 28C64 (B) (64K:8K*8)
• PIC brand: Microchip
• Package: DIP:Skinny-DIP, SOP, C-DIP (Window)
• 12C508A, 12C509A, 16C711, 16F84A, 16C54C, 16C55A, 16C56A, 16C57C
• Please contact us for further details
• _{Please note that we are not the original manufacturer or a licensed distributor of this product.}

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