Multilayer PCB R&D moves further toward high integration density

Companies making multilayer PCBs concentrate on HDI and flexible types as the ultraslim trend in terminal electronics applications continues.

As circuits become more dense to support complex functions in ever thinner electronics products, makers of multilayer PCBs in China respond by highlighting HDI and flexible types. The variants can accommodate more components while ensuring easy layout and enhanced shielding, compared with traditional single- and double-sided configurations. As such, these are expected to remain a priority development in the line and will result in steady releases in years to come.

Sunshine Global Circuits Co. Ltd has introduced 12-layer HDI PCBs with a 3+N+3 structure. The impedance-controlled boards use a Tg180 FR-base, H oz base copper on all layers, ENIG surface finish and gold solder mask. Its minimum line width and spacing are 5 and 4mil, and the smallest drill and BGA pad sizes 0.2 and 0.32mm. The units are UL-listed.

Globally, the HDI PCB segment has been posting almost 7 percent CAGR in total sales between 2012 and 2017, according to Prismark. It also continues to have a broadening share of the PCB industry, starting at 12 percent in 2010 and now reaching 16 percent.

Flexible PCBs are likewise gaining popularity in recent years based on climbing shipments. From a 16 percent increase in 2010, the jump will be as much as 24 percent before 2017 closes, said Prismark. Growth will be maintained in the next one to two years locally and overseas.

To take advantage of these market developments, China makers of multilayer PCBs continue to improve product performance. They are looking to use new laminate materials such as Zeta, I-Tera, I-Speed, Tachyon G100, Megtron 7, and EMC-828 and EMC-888K. Sunshine Global adopts the last in a 12-layer model.

Additional spur comes from being the world's largest PCB production base, which almost guarantees maximum gain from the industry's sustained expansion.

China accounts for 44 percent of global production value, according to Prismark, and has been benefiting from 5 percent annual growth in the past several years.

Based on statistics from China Industry Insights, the hub will at the same time exceed the entire sector's performance, which is pegged at 3.9 percent between 2012 and 2017. This comes from the projected world production value reaching $65.7 billion by end-2017 from $54.31 billion in 2012. Among types, multilayer PCBs will have a 32 percent market share by the end of the period.

Most local suppliers therefore plan to keep increasing output for multilayer PCBs by 5 to 10 percent in one to two years. Shenzhen X-Mulong Circuit Co. Ltd leveled it up to 15 percent in 2016 and will maintain this rate until this year's end.

Hundreds of companies make up China's manufacturing pool for the line and more than 70 percent of them are locally owned. Shennan Circuit, WUS Printed Circuit and Ellington Electronics are among the major players. Their foreign counterparts operating in the region include Zhen Ding Tech, Tripod Technology and Unimicron. The majority offers single- and double-sided PCBs as well.

Over 90 percent of the makers are in the Pearl River and the Yangtze River Delta regions, specifically in major cities such as Shenzhen, Huizhou, Dongguan and Zhuhai in Guangdong province and Kunshan in Suzhou province.