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Model SPE8589 PCB assembly from Seedling-Plan uses a 4-layer board with an immersion gold surface finish.
Product Details
Model: SPE8589
Supplier Profile
Year established: 2007
Export markets: Asia, Middle East, Africa, North America, Western Europe
Export products: PCB assemblies
Annual sales: $2 million to $3 million
Total staff: 200 to 249
Certifications: ISO/TS 16949:2009
This PCB assembly from Seedling-Plan Electronic Information (Shanghai) Co. Ltd adopts a 4-layer board with an FR-4 base and immersion gold surface finish. The 2mm-thick PCB has 5oz copper. BGA components are used and placed using SMT. The maker also employs DIP in board assemblies.
Seedling-Plan offers one-stop EMS solutions, covering PCB manufacturing, components sourcing, assembly and testing of finished products. It handles OEM and ODM projects. NEC, CASC, PixeLINK, GCI and Bosch are among the supplier' major customers.
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