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PCB assembly based on BGA technology uses through-hole or SMT placement.
Product Details
Model: Top-00188
MOQ: None
Certifications: CE, FCC, RoHS, UL
Supplier Profile
Year established: 2005
Export markets: Europe (50%), US (25%), Asia (25%)
Export products: PCBs (55%), PCB assemblies (45%)
Total staff: 450 to 499
Certifications: ISO 9001, 14001
Top Electronic Technology (Shenzhen) Co. Ltd's HDI PCB assembly adopts BGA technology, and through-hole or SMT placement. It integrates 1206, 0805, 0603, 0402 and 0201 components. The target applications are medical equipment, instruments, and networking products.
The unit undergoes X-ray and automated optical inspection. A lead-free version is available.
High-mix, low-volume orders are accepted.
Top manufactures HDI, heavy-copper, flexible, rigid-flex and metal-core PCBs in up to 28 layers. It offers component purchase and laser stenciling services, in addition to PCB assembly.
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