PCB assembly uses BGA technology

Global SourcesUpdated on 2023/12/01

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PCB assembly uses BGA technology

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PCB assembly

Fidelity Electronic Co. Ltd
(Mainland China)

Model: PCB Assembly 123
MOQ: 200 sets

Description:
- PCB assembly
- FR-4, UL94V-0-rated, CEM-1, CEM-3 or UL94HB base
- Tin or tin/lead hot air solder leveling, immersion gold, tin or silver, OSP, selective immersion gold or gold plating surface finish
- BGA technology
- Component sourcing
- Function testing, automated optical inspection, X-ray
- 19.5x15.5cm
- OEM/ODM orders accepted


Note: All price quotes in this report are in US dollars unless otherwise specified. FOB prices were provided by the companies interviewed only as reference prices at the time of interview and may have changed.

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