PCB assembly with 0.2mm IC pitch

Global SourcesUpdated on 2023/12/01

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Model J-174-PCBA PCB assembly from Shenzhen Makerfabs uses components that can be placed using DIP, SMT or mixed assembly technology.

Product Details

Model: J-174-PCBA

Lead time: 7 days

Supplier Profile

Year established: 2013

Export markets: North America, Western Europe, Asia

Export products: PCB assemblies

Total staff: 100

This PCB assembly from Shenzhen Makerfabs Corp., J-174-PCBA model, integrates 0201 components in any packaging such as SOP, CSP, SSOP, PLCC, QFP, QFN, BGA, FBGA and uBGA. BGA size is 8x6mm to 55x55mm, u-BGA diameter 0.2mm, IC pitch 0.2mm and minimum leg center distance 0.3mm.

Mounting can be via DIP, SMT or mixed assembly technology. PCB used is 600x1,200mm, and has lead-free HASL, ENIG or OSP surface finish and 0.5 to 5oz copper. It has ±0.076mm hole size and location tolerance.

Shenzhen Makerfabs provides one-stop solutions for PCB assemblies.

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PCB assembly with 0.2mm IC pitch

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