TSMC, ARM aim 7nm at data centers

Global SourcesUpdated on 2023/12/01

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Cloud computing the next process driver?

ARM and TSMC hope they can beat the competition to market with a 7nm SoC by teaming up.
Source: ARM & TSMC

TSMC and ARM have announced the next phase of their collaboration on leading-edge semiconductor process technology. Interestingly, they suggest data center and networking chips will be drivers of their work on the 7nm FinFET node.

To date, mobile application processors such as Apple's A series, Qualcomm's Snapdragon and Samsung's Exynos have been among the first SoCs to use new process technologies. Tapeouts of mobile chips using 64-bit ARM cores were among the early milestones for 16 and 10nm nodes.

Amid a slowdown in handset growth, the winds appear to be shifting. In a statement released mid-March, the two announced "a multiyear agreement to collaborate on a 7nm FinFET process ... The new agreement expands the companies' long-standing partnership and advances leading-edge process technologies beyond mobile and into next-generation networks and data centers."

Specifically, ARM said it is preparing a generation of "future ARM technology designed specifically for data centers and network infrastructure, and optimized for TSMC 7nm FinFET," according to the release from Pete Hutton, president of ARM's product group.

To read the full article, go to EETimes.

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