Shareconn's model USB30-01-01 USB 3.0 connector comes in SMD configuration and has phosphor bronze terminals. It meets UL.

Suppliers sustain production boost, leveraging USB’s established lead in the interfaces segment.

Portable electronics and computer products remain the growth catalysts driving China’s USB 3.0 connectors manufacture. Makers continue to raise output amid projections of annual uptick in sales surpassing 10 percent until end-2015. They are banking on climbing requirement in smartphones, tablet, notebook and desktop PCs, and digital cameras.

Manufacturers such as Shenzhen Youte Electronic Co. Ltd have been steadily bolstering yield. The supplier, which implemented a 10 percent increase last year, will do so again in coming months. It aims to realize 5 to 10 percent higher export shipments. The last currently represents 40 percent of turnout.

To cater to existing demand, the majority of suppliers are keeping USB 2.0 models in their catalogs. The type represents 20 to 50 percent of companies’ total yield. The share continues to drop, however, as emphasis has shifted to more-advanced 3.0 units. At Goldenconn Electronics (Suzhou) Technology Co. Ltd, the former standard still has a 50 percent portion of output but this may shrink to 40 percent in 2015.

Between 200 and 300 manufacturers in mainland China offer USB 3.0 connectors. Most produce other kinds and corresponding cable assemblies such as HDMI and DisplayPort.

More than half of the companies are locally owned and the rest have investment, mainly from Taiwan and Hong Kong. The coastal area still hosts over 90 percent of the makers, with production centered in Guangdong province, particularly in the cities of Shenzhen and Dongguan. The hub generates about 60 percent of the mainland’s yield.

The US, Europe and Asia remain the mainland’s key export destinations, while Russia, the Middle East and South America are emerging markets.

SuperSpeed Plus

An impetus fueling upbeat outlook for the overall USB category is the release of the 3.1 specification dubbed the SuperSpeed Plus. China manufacturers expect this to solidify the interface’s market foothold in the next years despite competing standards.

The upgrade supports 10Gbps, doubling the previous rate and matching that of Apple’s Thunderbolt. It has 3 to 5A rated current from 1.5A, enables plug-in and -out synchronization and can handle up to 127 devices.

In addition, USB 3.1 is backward-compatible with the 3.0 and 2.0 versions and can be used in products with Windows Vista, 7, 8, 8.1, Mac OS X and Linux OS.

SuperSpeed Plus connectors come in standard A, Micro B and type C configurations. The first is similar to 3.0 models in size. Micro B features a slightly wider design than its predecessor but can still be assembled using currently available cables.

The 8.3x2.5mm type C kind will have 100W rated power and can last up to 10,000 mating cycles. It is anticipated to become the standard interface of Android-based mobile electronics and may even be included in upcoming Apple devices.

At present, only a few local suppliers plan to enter the USB 3.1 segment. Makers such as Goldenconn will wait for adoption to take hold in terminal applications, but ensure readiness to produce compliant units on request.

Mainstream selection

The local range comes in type A and B, male or female, and SMD, straight, right-angle or flat-tail configurations. Units generally have gold-over-nickel-plated copper alloy or brass contacts, steel or copper alloy shells and UL94V-0-rated plastic housings.

All releases meet RoHS guidelines.

Materials are locally sourced, although companies accommodate buyers’ requests for imported inputs.

Stable material costs will keep prices at current levels in coming months. Some manufacturers have reduced quotes by 5 percent to cope with intensifying competition.

Related report:
eSATA connectors and cable assemblies: Suppliers maintain line for niche markets

Product gallery

Goldenconn Electronics (Suzhou) Technology Co. Ltd
(China)

Model: USB-S1LCH030
MOQ: 10,000 units
Delivery: 20 days
Description: DIP, type A, female; 1x2 row; copper alloy contacts, gold-plated contact and tin-plated solder areas, overall nickel underplating; nickel-plated brass shell; UL94V-01-rated 30% glass-filled PBT housing

Shareconn Development Co. Ltd
(China)

Model: USB30-01-01
MOQ: 1,000 units
Delivery: 5 days
Description: SMD; phosphor bronze terminal, contacts; liquid crystal polymer housing; UL

Shenzhen Antenk Electronics Co. Ltd
(China)

Model: U3AFR01
MOQ: 500 units
Delivery: 6 days
Description: DIP, type A, female; 1.5A maximum rated current; 50mohm maximum contact, 100Mohm minimum insulation resistance; 500VAC dielectric withstand voltage; gold-plated copper alloy contacts; tin-plated solder tails; nickel-plated iron shell; UL94V-0-rated PBT housing

Shenzhen Youte Electronic Co. Ltd
(China)

Model: 21B4.33361.01001
MOQ: 1,000 units
Delivery: 15 days
Description: DIP, type AF, right-angle, female; 30VAC/DC, 1A; 100VAC/min dielectric strength between adjacent terminals; 50mohm maximum contact resistance; gold-over-nickel-plated brass or copper alloy contacts; steel shell; UL94V-0-rated liquid crystal polymer, nylon or PBT housing; -25 to 85 C operating temperature