Anke's AK-1302087 model has eight layers and a Tg170 FR-4 base. Its minimum line width/spacing is 3mil.

Output consists of units with a low stack-up count, and any-layer variants. Greater circuit density is the key R&D objective.

HDI PCBs are a minority but growing segment in mainland China’s PCB industry. Besides steadily increasing production volume, makers are upgrading their selections. They are improving circuit density to keep up with the miniaturization and multifunction trends in electronics applications, particularly mobile devices. A number of companies can turn out boards with up to 24 layers, 1.6mil minimum line width and spacing, and 0.075mm holes. China Circuit has 1.6mil models in its catalog. Sun Light PCB & Technologies Ltd will introduce units with 0.075mm holes next year.

As for any-layer configurations used in upscale smartphones and tablet PCs, only large domestic suppliers can offer them at present owing to the high technology requirement. They include China Circuit and Zhuhai Founder. Most enterprises concentrate on types with one to three stack-ups. Foreign makers still dominate this classification.

HDI boards will represent nearly 7 percent of the mainland’s PCB yield by 2017 from about 5 percent in 2012. In terms of production value, the former’s share will reach 21 percent from 18 percent, with the bulk generated by international companies based there. This translates to 9 percent CAGR for the mainland, surpassing the global rate by almost 3 percent.

Encouraging local manufacture are the strong smartphone and tablet PC markets, which are expected to drive demand in coming years. Global shipments of the first will approach 1.3 billion units by end-2014 and exceed 2 billion in 2018, according to ABS Research. That of tablet computers will be 233 million and 304 million units, based on IDC estimates.

Companies also look to benefit from rising requirement in the automotive electronics, industrial, medical and telecom fields, and wearable devices.

Shenzhen Shenyixin Electronic Ltd expects HDI PCBs to generate 35 percent of sales in 2015 from about 30 percent. The category’s current share is 30 percent at Meizhou Dingtai PC Board Co. Ltd, 10 percent at Anke Circuit Technology Co. Ltd and 5 percent at Sun Light.

Only about 10 percent of the 1,500 PCB makers in the mainland offer HDI types. Most companies are in the Pearl River and Yangtze River Delta regions.

Local range

The mainland selection consists of 1+N+1, 2+N+2, 3+N+3, 4+N+4, 5+N+5 and any-layer HDI PCBs. Mostly in 4, 6, 8 and 10-layer configurations, the first three stack-ups make up more than 80 percent of output. Besides mobile phones and tablet PCs, the applications include digital cameras and GPS devices.

The typical options by minimum line width and spacing are 2, 3 and 4mil, and based on hole size, 0.1 and 0.15mm. Anke, Sun Light and Shenzhen Shenyixin can offer units with 3mil minimum line width and spacing, and up to 0.1mm holes.

Products adopt OSP, immersion gold or silver, or gold plating surface finish.

Makers obtain CCL from local and Taiwan providers. The key sources include Nanya, Kingboard, Iteq, EMC and Shengyi. Copper foil, prepreg, copper granules, tin lead bars, gold salt and chemical materials are from the domestic supply.

Input cost remains stable, but labor outlay and yuan valuation are still on the rise. Despite this, companies are keeping prices unchanged until 2015 to boost orders.

Related reports:
Multilayer PCBs: Low layer-count units still dominate supply
Flexible PCBs: Manufacturers sustain product upgrades, output expansion
PCB assemblies: Makers strengthen SMT capability
Aluminum PCBs: Enhanced thermal conductivity remains on R&D agenda

Product gallery

Anke Circuit Technology Co. Ltd
(China)

Model: AK-1302087
MOQ: 5 units
Delivery: 7 days
Description: Eight layers; Tg170 FR-4 base; immersion gold surface finish; 3mil minimum line width/spacing; 0.1mm laser-drilled blind, buried via size; impedance control; 1mm board thickness

Guangdong Xingda Hongye Electronic Co. Ltd
(China)

Model: PCB-6L
Description: Six layers; FR-4 base, 1.6mm; immersion gold+gold finger surface finish; 3.9mil line width, 4.2mil spacing; 0.2mm minimum hole size; ≥20µm copper thickness; 168.4x112.2mm; for digital cameras

Jasecen International (HK) Co. Ltd
(China)

Model: Jasecen-002
Description: Eight layers; FR-4 base; via-in-pad; 0.8mm board thickness; impedance control; for tablet PCs

Meizhou Dingtai PC Board Co. Ltd
(China)

Model: 258
MOQ: 1 unit
Delivery: 8 days
Description: Four layers; FR-4 base; immersion gold surface finish; 0.2mm minimum via size; 1.2mm board thickness

Shenzhen Keyou Circuit Technology Co. Ltd
(China)

Model: Keyoupcb-6L
Description: Six layers; lead-free HASL surface finish; 4mil minimum line width/spacing; copper-filled vias, 0.2mm minimum size; 1.2mm board, 1.58mm±10% finished thickness

Shenzhen Shenhtak Circuits Technology Co. Ltd
(China)

Model: S201404051345
Description: Eight layers; FR-4 base; ENIG surface finish; 4mil minimum line width/spacing; 0.1mm minimum laser-drilled hole, plated blind via size; 50ohm±10% characteristic, 100ohm±10% differential impedance; green solder mask; white legend; 1.6mm±10% board thickness

Shenzhen Shenyixin Electronic Ltd
(China)

Model: SYX-01
MOQ: 1 unit
Delivery: 5 days
Description: Four layers; FR-4 base; gold-plated surface finish; green solder mask; white legend; 80x60mm; 1.6mm board, 1oz copper thickness

Sun Light PCB & Technologies Ltd
(China)

Model: H8G
Delivery: 5 days
Description: Eight layers; Tg150 FR-4 base; chemical gold surface finish; 3mil minimum line width, 4mil spacing; 0.1mm minimum hole size; 1.55mm board, 35μm top and bottom, 18μm inner copper thickness; 340x300mm; RoHS