Continuing advancements in the fields of 5G communication, cloud computing, AI, Industry 4.0 and the Internet of Things will continue to emphasize the advantages of HDI PCBs among multilayer types. These boards support designs for current and next-generation applications across various industries, where weight, space, reliability and performance are primary concerns.
Globally, HDI PCBs have a developing market, with the IMARC Group projecting a 5.5 percent CAGR between 2023 and 2028, reaching $11.5 billion. This forecast is based on increasing use in end-use industries, including smartphones, computers and other consumer electronics, telecom or datacom and automotive applications.
In China, HDI boards with a high layer count are on the R&D agenda of multilayer PCB manufacturers. These will expand the range in the multilayer category, which consists mainly of rigid, flexible and rigid-flex types with four to 40 layers.
Multilayer PCBs widely available from Chinese companies are made of various base materials such as FR-4, high-Tg, Rogers, Teflon, halogen free, or polyimide. They feature a minimum line width and spacing of 3mil, hole sizes as small as 0.15mm, and copper thickness ranging from 1 to 6oz. These boards have HASL, lead-free HASL, immersion or silver, OPS, ENIG or flash gold surface finish. Industry standards that are followed include CE, UL and RoHS.
The materials used in the production of multilayer PCBs in China come from domestic suppliers such as SYTECH, Nouya, Goldenmax and Wazam. Their costs are expected to remain stable and keep product prices under control.
Multilayer PCB, CEM-1 base material
Company: Dongguan Yuk Shing PCB Co. Ltd
The CEM-1-7726 multilayer PCB from Dongguan Yuk Shing has 4mil minimum line width and spacing, 0.2mm minimum hole size, immersion gold or lead-free HASL surface finish, 1 to 6oz copper and 1.6mm board thickness. It meets RoHS and UL requirements.
MOQ: 1,000 units
Lead time: 15 days
Multilayer PCB, 0.2mm minimum hole size
Company: Dongguan Yuk Shing PCB Co. Ltd
A 1.6mm-thick multilayer PCB from Dongguan Yuk Shing, model CEM-1-1888 has 4mil minimum line width and spacing, as small as 0.2mm holes and immersion gold or lead-free HASL surface finish. Copper used is 1 to 6oz. This PCB is RoHS-compliant and UL-listed.
MOQ: 1,000 units
Lead time: 15 days
HDI PCB, 14 layers
Company: Shenzhen BenQiang Circuit Co. Ltd
Shenzhen BenQiang’s C42802DC14A0 is a 1.6±0.1mm-thick HDI PCB with 14 layers, 6+N+6 structure, as small as 0.15mm laser and 0.2mm drilled holes, 2.95mil minimum width and spacing and 0.05µm ENIG surface finish. Its aspect ratio is 8:1. This PCB is for industrial control applications.
MOQ: Negotiable
Lead time: 7 days
10-layer PCB, 1±0.1mm thickness
Company: Shenzhen BenQiang Circuit Co. Ltd
Shenzhen BenQiang offers the S221021G10, a 10-layer PCB for communication devices. This unit has 0.1mm minimum laser and 0.15mm drilled hole sizes, 3.9mil minimum line width and spacing, hard gold surface finish and 1±0.1mm board thickness.
MOQ: Negotiable
Lead time: 7 days
PCB, up to 46 layers
Company: Topfast (Guangdong) Technology Co. Ltd
Topfast’s Multilayer PCB-8628 can have up to 46 layers, an FR-4, high-Tg FR-4, Megtron 4 or 6, Rogers, Nelco or Isola base material and ENIG, HASL, OSP, ENEPIG or flash gold surface finish. It has 3mil minimum line width and spacing, 0.1 to 6.5mm holes, 0.5 to 10oz copper and 0.4 to 6.5mm board thickness.
MOQ: Negotiable
Lead time: 7 days
Multilayer PCB, 0.1 to 6.5mm holes
Company: Topfast (Guangdong) Technology Co. Ltd
The Multilayer PCB-0609 from Topfast is available in up to 46-layer variants with an FR-4, high-Tg FR-4, Megtron 4 or 6, Rogers, Nelco or Isola base material and ENIG, HASL, OSP, ENEPIG or flash gold surface finish. The minimum line width and spacing is 3mil, hole size 0.1 to 6.5mm, copper 0.5 to 10oz and board thickness 0.4 to 6.5mm.
MOQ: Negotiable
Lead time: 7 days
