PCB assembly for smart ovens

Global SourcesUpdated on 2023/12/01

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This PCB assembly from Tecoo, the TE-9-36, can accommodate components with 0.5mm minimum BGA or minimum 0.4mm IC pitch.

Product Details

Model: TE-9-36

MOQ: 100 units

Lead time: 7 to 10 days

FOB price: $7

Supplier Profile

Year established: 2002

Export products: Smart controllers, PCBs

Annual sales: $9 million to $10 million

Total staff: 100 to 150

Certifications: ISO 9001:2015

This TE-9-36 model from Tecoo Electronics Co. Ltd is a PCB assembly for ovens with an app-enabled smart control feature and a high-precision electronic temperature sensor.

It uses a PCB with up to 22 layers, and minimum 0.5mm-pitch BGA and minimum 0.4mm-pitch IC components. The circuit board assembly undergoes ICT, X-ray and function tests.

Tecoo provides one-stop EMS and conducts QC in-house.

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PCB assembly for smart ovens

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