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IRDS points to chip stacks and new architectures.
Traditional semiconductor scaling is expected to reach an end by about 2024, according to a white paper from engineers working on a new version of the semiconductor roadmap. The good news is a wide variety of new kinds of devices, chip stacks and systems innovations promise to continue benefits in computing performance, power and cost.
"Die cost reduction has been enabled so far by concurrent scaling of poly pitch, metal pitch, and cell height scaling. This [will likely] continue until 2024," according to one of nine white papers published as part of the International Roadmap for Devices and Systems or IRDS.
Beyond that date "there is no room for contact placement as well as worsening performance as a result of contacted poly pitch or CPP scaling. It is projected that physical channel length would saturate around 12nm due to worsening electrostatics while CPP would saturate at 24nm to reserve sufficient CD (-11nm) for the device contact providing acceptable parasitics," the white paper reported.
The IRDS is an expanded version of the International Technology Roadmap for Semiconductors or ITRS, first published in 1965. The effort was taken over by the IEEE in May last year when it was renamed the IRDS and expanded to cover new kinds of system-level technologies.
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