Multilayer PCB production moving toward additive technologies

As demand for miniaturization continues alongside the requirement for a greater number of interconnections, PCB development will favor higher-layer, HDI, flexible and package substrate PCBs. These boards are expected to become mainstream, with a combined global market share reaching about 61 percent in 2021, according to Prismark.

Additive technologies commonly used in IC substrate production are increasingly finding a place in the manufacturing sector, departing from the dominant subtractive technique used in PCB production. These methods are semi-additive process (SAP), modified SAP (mSAP) and advanced mSAP (amSAP). SAP enables realization of 30µm minimum line spacing, mSAP 20µm and amSAP 8µm.

In China, manufacturers of multilayer PCBs are planning to boost the release of boards with more than 12 layers while continuing to enhance reliability and stability characteristics of current output.

Shenzhen Lianjincheng Technology Co. Ltd has introduced 16-layer high-frequency PCBs with impedance control, mainly for communications applications. It will continue to focus on higher-layer boards in the years ahead.

At the same time, suppliers hope to progressively shift to high density interconnect (HDI) PCBs to meet the 5G-driven trends for further miniaturization, and high frequency, transmission speed and integration in smartphones, tablet PCs and wearable devices. To realize this goal, they are looking to adopt additive manufacturing technologies.

Companies interviewed by Global Sources Electronic Components say HDI boards will form the bulk of output from China's PCB sector in the coming years. Compared to standard types, HDI units have finer spaces and lines, with typical varieties having 50 to 75µm line pitch and width.

Steady market growth

The global PCB industry is forecast to post a CAGR of less than 5 percent from 2020 to 2024, with total production value to arrive at $75.846 billion at the end of the period, according to Prismark. In 2019, it realized $61.3 billion or a negative growth of 1.7 percent YoY.

The positive outlook in the next few years comes on the back of the anticipated demand rise from 5G, the Internet of Things, AI and Industry 4.0 trends.

China has a slightly different trend. It realized a 9.03 percent CAGR in 2019, with $38.92 billion from $15.037 billion in the previous year. Prismark estimates a 4.9 percent CAGR for the world's largest PCB production base from 2019 to 2024, outperforming other hubs and the global average.

The country's multilayer PCB segment is expected to maintain a growth rate of between 5 and 10 percent in the next two years, according to suppliers interviewed. The pandemic affected manufacturing activities in early 2020, but most manufacturers were able to resume normal operations by mid-year.

Shenzhen Yifang Electronics Co. Ltd, already increased output by 35 percent in 2020, is ready to ramp up production anew to meet local and overseas orders.

Shenzhen Lianjincheng, on the other hand, is planning to invest $147 million to open a new factory in Jiangxi province by the end of 2021.

More than a thousand PCB manufacturers operate in China, including foreign-invested businesses.

The top 100 companies realized a total turnover of $34.91 billion in 2019, with the top 100 Chinese suppliers accounting for $16.25 billion, according to the China Printed Circuit Association. Avary Holding, Suzhou DSBJ and Tripod Technology were the homegrown leaders.

Other major suppliers in China include Compeq, Kingboard, Mektec, Unicorn and WUS.

More than half of the manufacturers are in Shenzhen, Dongguan, Guangzhou and Zhongshan in Guangdong province. The rest are in other parts of the Pearl River Delta, the Yangtze River Delta and the Bohai Bay Rim Economic Region.

4- to 12-layer PCBs lead

Multilayer PCBs from Chinese companies are available in rigid, rigid-flex and flexible types with up to 32 layers. Those with four to 12 layers currently dominate shipments.

Typical specifications are 3mil minimum line width and spacing, 0.2mm minimum hole size, 0.5 to 7oz copper thickness and 0.21 to 7mm board thickness. Boards have immersion gold silver or tin, HAL or ENIG surface finish.

All products comply with RoHS requirements.

Key materials used in the production of multilayer PCBs, such as FR-4, polyimide, CEM-1, CEM-3, Tg, high-Tg and Rogers laminates, copper and adhesives, are sourced from domestic or foreign suppliers, depending on customers' requests.

Input costs rose significantly in 2020, forcing most manufacturers to adjust product prices by 10 to 15 percent. In 2021, the situation is expected to stabilize.

6-layer PCB, with 0.2mm minimum hole size

This 6-layer PCB from Camelot Electronic Technology Co. Ltd, the 6C88018A0, uses a Tg150 FR-4 base with immersion gold surface finish, gold fingers, peelable glossy green solder mask and white silk-screening. The 126.91x87.94mm unit has as small as 0.2mm holes. Board thickness is 1mm.

The five-unit minimum order has a five-day lead time.

Inquire now

FR-4 PCB, has 16 layers

Golden Circuits Technology Co. Ltd markets this 16layerPCB model with an FR-4 base, immersion gold surface finish and green solder mask.

The negotiable order quantity has a seven-day delivery lead time.

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4-layer PCB for server controllers

Model LJC-85 4-layer PCB from Shenzhen Lianjincheng Technology Co. Ltd has lead-free HASL surface finish, 2oz finished copper and 1.6mm board thickness. It suits server controllers.

An order of at least five units is delivered within seven days.

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12-layer PCB for data acquisition devices

For data acquisition devices, this multilayer PCB from Shenzhen Yifang Electronics Co. Ltd, the 12 Layer Boards, has an FR-4 base and ENIG surface finish. It has 4mil line width and spacing, 0.25mm minimum hole size and 1.6mm board thickness.

The order quantity is negotiable. Delivery is within seven days.

Inquire now

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